| 产品信息 | 产品图片 | 产品描述 | 产品编码 | 竞品购买 | 操作 |
|---|---|---|---|---|---|
 PCB线路板
|
|
Ф3.5mm PHONE JACK,3段 沉板SMT,端子镀金... 更多详情 | 27328 | 样品申请 |
| 产品材质 | terminal 1: | copper alloy t=0.20,Au-plated | ||
| terminal 2: | copper alloy t=0.20,Au-plated | |||
| shell: | sus301 t=0.20,Ni-plated | |||
| terminal 3: | copper alloy t=0.20,Au-plated | |||
| terminal 4: | copper alloy t=0.20,Au-plated | |||
| terminal 5: | copper alloy t=0.20,Au-plated | |||
| terminal 6: | copper alloyt=0.20, Au-plated | |||
| housing: | high temp,thermoplastic,black | |||
| mylar: | black | |||
| 环境条件 | Temperature range: | -30 °C/+70 °C | ||
| Mating cycles: | 5000 | |||
| Insertion force: | 3–20 N | |||
| Withdrawal force: | 3–20 N | |||
| 电气数据 | Contact resistance: | ≤ 30 mΩ | ||
| Rated current: | 0.5 A | |||
| Rated voltage: | 30 V AC/DC | |||
| Rated impulse voltage: | 500 V/60 s | |||
| 产品材质 | terminal 1: | copper alloy t=0.20,Au-plated | ||
| terminal 2: | copper alloy t=0.20,Au-plated | |||
| shell: | sus301 t=0.20,Ni-plated | |||
| terminal 3: | copper alloy t=0.20,Au-plated | |||
| terminal 4: | copper alloy t=0.20,Au-plated | |||
| terminal 5: | copper alloy t=0.20,Au-plated | |||
| terminal 6: | copper alloyt=0.20, Au-plated | |||
| housing: | high temp,thermoplastic,black | |||
| mylar: | black | |||
| 环境条件 | Temperature range: | -30 °C/+70 °C | ||
| Mating cycles: | 5000 | |||
| Insertion force: | 3–20 N | |||
| Withdrawal force: | 3–20 N | |||
| 电气数据 | Contact resistance: | ≤ 30 mΩ | ||
| Rated current: | 0.5 A | |||
| Rated voltage: | 30 V AC/DC | |||
| Rated impulse voltage: | 500 V/60 s | |||
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